MicroMID® 2-shot injection molding (2K)
2-shot injection molding produces the conductive pattern (1st shot) and insulation areas (2nd shot)
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With additive laser direct structuring following the LPKF LDS® process, structuring occurs by means of laser beams by releasing and activating special active substances (additives) in the plastic compound. Applications for this technology are 3D substrates or cavity packages for semi-conductor chips.
Anlagen für 1- und 2-Komponeten- spritzgiessen
Benefits:
- 3D circuit carrier
- Vias, 2 layers and crossings are possible
- PCB and housing as integral parts
- Combination of circuit carrier and housing are possible
- Circuit, shielding and antenna functions can be integrated
| Process characteristics | |
|---|---|
| Conductive pattern definition | Injection molding |
| Substrate material | Combination of, for example, PC/ABS, LCP/LCP, PPA/PPS |
| Minimum line width | 300 µm |
| Maximum number of circuit layers | 2 |
| Crossed lines | Yes |
| Vias | Yes |
| Possible assembly techniques | Wirebond, NCA flip-chip, SMD |
| 3D design flexibility | High |
| Re-design flexibility | Low |