Laser Direct Structuring (LPKF LDS®)

Additive conductive pattern structuring for 3D-MID substrates

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Microphone carrier for hearing aid from Siemens (process stages)

With additive laser direct structuring following the LPKF LDS® process, structuring occurs by means of laser beams by releasing and activating special active substances (additives) in the plastic compound. Applications for this technology are 3D substrates or cavity packages for semi-conductor chips.

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Laser equipment for 3D-structuring of plastic substrates

Benefits:

  • 3D circuit board
  • Circuit and antenna function can be integrated
  • Combinations of circuit board and housing are possible
  • High degree of design flexibility

 

Process characteristics
Conductive pattern definition Additive
Substrate material LPKF LDS®-compatible PA, LCP, PBT
Minimum line width 150 µm
Maximum number of circuit layers 2
Through hole platings Yes
Possible assembly techniques NCA flip-chip, SMD, attach & wire bond
3D design flexibility Medium
Re-design flexibility High