Cavity Packages & Substrates
Due to our core competencies in the fields of micro packaging and assembly and the associated support processes, we are able to provide you with custom-tailored and optimal solutions for your specific needs.
Technology selection criteria:
- Design-flexibility, dimensionality (2 / 2.5 / 3)
- Assembly technology
- Connectivity
- minimum feature sizes
- relationship between investments and component costs
HARTING Mitronics provides 2 different technologies for the manufacture of MicroMID®:
-
MicroMID® 2-shot injection molding (2K)
Technology for 3D substrates and cavity packages
for semiconductor system integration. -
Laser Direct Structuring (LPKF LDS®)
Additive structuring of conductive pattern for 3D-MID substrates.