SMD on MID
The same assembly techniques that are common and well proven in the PCB manufacture apply for the assembly of SMDs on MIDs as well. At HARTING Mitronics mainly reflow soldering and conductive gluing are deployed.
Due to the 3D character of MIDs, components can be space saving and well-hedged placed in cavities, thereby also facilitating potting.
For the assembly of 3D substrates, the following equipment is installed at HARTING:
Two Microns from ESEC AG, suited for dispensing and assembly at an accuracy of ± 12 um.
One die bonder und component placer from Dr. Tresky AG for manual dispensing and assembly.