Assembly technologies

Chip assembly covers the mechanical and electric connection of the bare, still unprotected (Si) chips to a housing or an assembly substrate, including the first protection against environmental influences.

For chip assembly on 3D substrate bodies produced with LPKF LDS® or 2-shot, technologies, already established in the
industrial assembly of two-dimensional carriers, are adapted.


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    Flip-Chip

    A bare die is contacted with the contacts facing down (flipped)


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    Wirebonding

    A bare die is contacted with wires of aluminum or gold.


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    SMD on MID

    Surface mount device:
    A housed component is contacted with conductive adhesive or soldering


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    MID on PCB

    The assembled MID can itself be attached to a PCB as an SMD component.