Production & Technology
Due to HARTING Mitronics core competencies in the fields of micro packaging and assembly and the associated support processes, we are able to provide you with custom-tailored and optimal solutions for your specific requirements.
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Cavity Packages & Substrates
3D MID Housings made in LCP or PBT can support the realization of additional functions. The utilization of the third dimension opens up new possibilities for the construction of sensor.
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Assembly technologies
COB (Chip on Board) Technology is favored for microsystems in order minimize space consumption. NCA Flip Chip and wirebonding are applicable and available technologies for MID substrates.
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Support processes
We provide molding tools and handling systems for the whole product life cycle from prototypes to multimillion series production.