Pressure Sensor for Industrial Application
LPKF LDSĀ® Technology Allows a Platform Strategy for Pressure Sensor Packages
- Different versions are realized by changing the laser program
- Various chip sets and circuit layouts allow completely different products within the same package running on one production line
- At least 12 variants are possible combining 3 sensor elements with 2 ASICs and 2 different output circuits per ASIC
A Pressure Sensor for Industrial Application
- The signal conditioning ASIC is integrated
- Mechanical interfaces are part of the housing
- The package is designed for SMT mounting on PCB
- Differential- absolute- und relative pressure measurements are optional using one or two tube ports
- Different chip sets and circuits are possible by changing the laser written layout of interconnects




