Sensors
The possibility of 3-dimensional shaping using MID technology offers important advantages
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- The 3D design of the MID technology creates possibilities to align sensors for vectorial sizes precisely in one direction. Naturally, several sensors can also be aligned with one another exactly in one module for spatial measurements.
- Design and material options allow the sensor element to be decoupled from thermal and mechanical stress as much as possible with little effort. This is an important step towards achieving further system advantages related to precision and simplifying calibration.
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- Additional savings in comparison to conventional housings occur because individual parts can be omitted.
- MID Technology makes spatial integration possible through use of MID which is an important advantage in the system context and also on a cost and performance level.
- The use of Flip-Chip or WireBond bonding engineering allows a sensor specific installation in the MID housing.
- Laser structuring of the MID injection molding body allows changes in design and formation of variants without a great deal of expenditure.
- The MID technology is also capable of providing highly precise and tailored solutions for smaller production runs at reasonable prices.
