Applications
3D MicroMID® offers the following benefits:
- Reduction of complexity because the 3D MID substrates integrate several functions
- Lower assembly costs because of the compact construction
- Possibility to increase reliability because interfaces can be eliminated
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Sensors
The package integrates functionality such as sealing, shielding and precise positioning of the components.
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3D wiring
Integration of conductors into the most minute areas for space optimization.
Applications are in industry, automotive, health care and mobile communication. -
RFID transponders
UHF RFID transponders with a high read range on metals and fluids for production- and transport logistics.


