3D-MID competence without compromise

When implementing individual 3D-MID packages, HARTING draws on its comprehensive, in-depth competence and the many years of experience that cover the entire value chain – from the initial ideas all the way through to series production. This comprehensive approach to development and manufacturing allows us to utilize the full potential of 3D-MID technology and implement individual solutions.

The great scope of design freedom, the achievable extent of miniaturization and the resulting weight reduction are some of the strengths of 3D-MID components. We can also integrate a multitude of functionalities, such as 3D conductor path structures, antennas, switches, connectors, heating elements and sensors. In this way, we will transform your idea into a persuasive product

Our Competences

In a process of partnership based dialog,
we implement your idea – from the
development of interconnect devices
suitable for manufacturing to the early...

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Product Development

With the proven series production tech-
nologies of two-component injection
molding and laser direct structuring,
HARTING offers you a focused...

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Manufacturing Technologies

At HARTING Mitronics various connection technologies, such as SMD packaging, chip assembly, and the combination of MID and PCBs or MID...

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Connection Technology